375024B00032G BOYD CORP
Details
Manufacturer product page BOYD CORP
Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Manufacturer code: 375024B00032G
OMI code: 311103
Adding to order
In stock:
0 pcs
|
Qty. [pcs] |
Price [EUR/pcs] |
|---|---|
| 450+ | 4.42 |
Price details
375024B00032G
|
Qty. [pcs] |
Price [EUR/pcs] |
|---|---|
| 450+ | 4.42 |
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Specification
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